Hydrosilex Cutting Compound

HydroSilex Cutting Compound is an advanced polishing solution designed for detailers seeking to achieve hologram-free results with exceptional depth of gloss. This medium cut and finish polish is formulated with diminishing abrasives, ensuring consistent breakdown during use. Ideal for dual-action and random orbital polishers, it promises a superior finish without the drawbacks of traditional compounds.

Key Features:

• Diminishing Abrasives: Engineered to provide a medium cut while breaking down consistently for a smooth finish.
• Hologram-Free Results: Specifically formulated to eliminate holograms and produce a clear, reflective surface.
• Water-Based Formula: Contains no solvents, silicones, fillers, or petroleum, making it a safer choice for both users and the environment.
• Dust-Free Application: The unique formulation prevents dust production during polishing, ensuring easier cleanup and longer pad life.
• Versatile Use: Compatible with dual-action and random orbital polishers for optimal performance.

Recommended Use:

1. Preparation: Shake the bottle well before use to ensure even distribution of ingredients.
2. Application: Apply 5-6 drops of HydroSilex Cutting Compound onto the buffing pad.
3. Spreading: Spread the compound across the 2x2 working area before turning on the buffer.
4. Polishing Technique: Maintain a slow tempo and arm speed. Avoid overworking the product until it dries out.
5. Surface Lubrication: Keep the surface area lubricated with the compound for best results throughout the polishing process.

HydroSilex Cutting Compound is the perfect solution for professional detailers and enthusiasts alike, providing a powerful yet safe medium cut polish that delivers stunning results. Its innovative formula ensures a clean, dust-free experience, allowing you to achieve a high-gloss finish without the hassle of traditional compounds. Upgrade your polishing routine with HydroSilex Cutting Compound and experience the difference!