Hydrosilex Cutting Compound 8oz

HydroSilex Cutting Compound is an advanced polishing solution designed for detailers seeking to achieve hologram-free results with exceptional depth of gloss. This medium cut and finish polish is formulated with diminishing abrasives, ensuring consistent breakdown during use. Ideal for dual-action and random orbital polishers, it promises a superior finish without the drawbacks of traditional compounds.

Key Features:

• Diminishing Abrasives: Engineered to provide a medium cut while breaking down consistently for a smooth finish.
• Hologram-Free Results: Specifically formulated to eliminate holograms and produce a clear, reflective surface.
• Water-Based Formula: Contains no solvents, silicones, fillers, or petroleum, making it a safer choice for both users and the environment.
• Dust-Free Application: The unique formulation prevents dust production during polishing, ensuring easier cleanup and longer pad life.
• Versatile Use: Compatible with dual-action and random orbital polishers for optimal performance.

Recommended Use:

1. Preparation: Shake the bottle well before use to ensure even distribution of ingredients.
2. Application: Apply 5-6 drops of HydroSilex Cutting Compound onto the buffing pad.
3. Spreading: Spread the compound across the 2x2 working area before turning on the buffer.
4. Polishing Technique: Maintain a slow tempo and arm speed. Avoid overworking the product until it dries out.
5. Surface Lubrication: Keep the surface area lubricated with the compound for best results throughout the polishing process.

HydroSilex Cutting Compound is the perfect solution for professional detailers and enthusiasts alike, providing a powerful yet safe medium cut polish that delivers stunning results. Its innovative formula ensures a clean, dust-free experience, allowing you to achieve a high-gloss finish without the hassle of traditional compounds. Upgrade your polishing routine with HydroSilex Cutting Compound and experience the difference!

Hydrosilex Cutting Compound is the latest formulation of diminishing abrasives providing a medium cut & finish polish for hologram-free results. Engineered specifically for use with dual-action or random orbital polishers. the abrasives break down very consistently to produce the highest depth of gloss. Hydrosilex Cutting Compound is water-based and contains no solvents, like silicones, fillers or petroleum. No dust is produced during polishing which makes for easy clean up and prolongs the life of the polishing pads.

RECOMMENDED USE: 

Shake Before Use. Apply 5-6 drops onto the buffing pad for a 2x2 area. Spread across working area before turning on buffer. Maintain a slow tempo and arm speed. Do not work overwork product until dry. Keep surface area lubricated with compound.